With the development of AI technology, Nvidia CEO Jensen Huang has emphasised that AI has become an essential infrastructure, much like electricity or the internet. He introduced the “AI 5-Layer Cake” model, segmenting the industry from the ground up into Energy, Chips, Infrastructure, Models, and Applications.
This represents significant infrastructure development, expected to drive substantial new investment opportunities across multiple sectors. Ultima Markets is expanding its offering with new AI infrastructure CFDs, giving clients direct access to the sector’s growth.
Layer 1: The Energy Layer
Jensen Huang has noted that energy is the first principle of AI infrastructure and the bottleneck factor determining how much intelligence a system can produce. Since every AI computation consumes immense power, there is rigid demand for the large-scale deployment of nuclear, natural gas, and renewable energy.
– Nuclear & Power Infrastructure: CEG (Constellation Energy), TLN (Talen Energy), OKLO (Oklo Inc.). As AI data centres rely heavily on stable, massive power supplies, nuclear energy has become a preferred choice for tech giants.
– Uranium & Energy Commodities: CCJ (Cameco), UUUU (Energy Fuels), UNG (United States Natural Gas Fund). Securing nuclear fuel and natural gas supplies is essential for securing the source of AI computing power.
– Energy Equipment Giants: GEV (GE Vernova). As a provider of power generation and grid equipment, GE Vernova directly benefits from the massive power grid upgrades spurred by AI.
Layer 2: The Infrastructure Layer
AI data centres encompass land, power supply, cooling systems, networking, and dispatch systems. The construction of these facilities presents substantial opportunities for construction and systems integration.
STRL (Sterling Infrastructure): Specialises in the construction and engineering of large-scale data centre facilities and industrial plants.
CLS (Celestica): Provides hardware manufacturing solutions for cloud and communication equipment, supporting the deployment of AI factories.
Layer 3: The Chip Layer
The chip layer is responsible for converting energy into computing power. TSMC points out that performance here depends on perfect internal integration: Logic Computing for processing, Advanced Packaging (3D Stacking) for system integration, and Optical Transmission (High-Speed Connectivity) to solve transmission bottlenecks.
– Logic Computing & Equipment: ASML (ASML Holding), ARM (Arm Holdings). As TSMC advances toward 2nm, A16, and A14 process nodes, ASML’s Extreme Ultraviolet (EUV) lithography systems remain critical for pushing the limits of transistor scaling. ARM also provides foundational architecture design, serving as a cornerstone of computing development.
– Optical Transmission & High-Speed Connectivity: LITE (Lumentum), COHR (Coherent), CRDO (Credo). To solve transmission bottlenecks in AI accelerators, silicon photonics and high-speed interconnects have become critical in determining chip performance ceilings, offering considerable potential for optical communication equipment and chip providers.
– Process Control & Inspection: ONTO (Onto Innovation), TER (Teradyne), KEYS (Keysight Technologies). As chips transition to 3D stacking and advanced nodes, demand for yield management and high-end inspection equipment is surging.
Layers 4 & 5: The Model & Application Layers
The model layer is responsible for understanding the world, while the application layer is the final outlet for AI to create economic value. As AI evolves from an assistive tool into a real-time intelligent digital workforce, each successful application drives demand back up the chain, creating a powerful flywheel effect.
– Software & Platform Applications: APP (AppLovin), FIG (Figma). By deploying native AI-driven design tools and advanced predictive recommendation algorithms, these platforms showcase the application layer’s capacity to directly monetise enhanced computing features and generate robust free cash flow
Product Specifications
US Stocks and ETFs
– Launch Date: 25 May 2026
– Launch Server: MT5
– Leverage: 5x (20% Margin)
– SWAP: -6 / 1.5
– Trading Hours: Monday to Friday, 16:30-23:00 (GMT+3)
Additional US Stocks and ETFs Available
MCHI (iShares MSCI China ETF), EWY (iShares MSCI South Korea ETF), EWJ (iShares MSCI Japan ETF), EWZ (iShares MSCI Brazil ETF), INDA (iShares MSCI India ETF), TOQQ (ProShares UltraPro QQQ ETF), TLT (iShares 20+ Year Treasury Bond ETF), KTOS (Kratos Defense & Security Solutions Inc), CRCL (Circle Internet Group Inc), SBET (SharpLink Gaming Inc), BLSH (Bullish Inc.), BMNR (BitMine Immersion Technologies Inc), GLXY (Galaxy Digital Inc.), CLSK (CleanSpark Inc), INSM (Insmed Incorporated), TME (Tencent Music Entertainment Group – ADR).
Clients can now explore these AI infrastructure CFDs on the Ultima Markets platform, developing their understanding of these evolving markets and making informed trading decisions.
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